Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

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Pages: 550, Paperback, Independently published

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Brand Independently Published
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  • 9798190431759

Springer

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

€ 128.79
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Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

€ 113.36
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Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

€ 87.20
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ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

€ 11.84
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