Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

Prices from
64.97

Sponsored links

COMPARE ALL WEBSHOPS (1)

Description

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

Description Description
Product Specifications Product specifications
Related results Related results
Next
Previous

Compare webshops (1)

Sponsored links · Some shops pay us a fee

Sort by:

€ 64.97

Description (0)

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

Product specifications

Brand Independently Published
EAN
  • 9798190431759

Springer

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

€ 114.08
More Information More Info

Independently Published

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

€ 11.12
More Information More Info

Independently Published

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and...

€ 23.15
More Information More Info

Independently Published

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and...

€ 16.92
More Information More Info
Featured Choice
€ 64.97
To Shop