Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

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Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

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Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

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Brand Independently Published
EAN
  • 9798190431759

Springer

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