Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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Pages: 511, Paperback, Independently published

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Springer

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The Semiconductor Manufacturing Handbook: Fabrication Processes, Equipment, Materials, Packaging, Testing, and Advanced Chip Technologies

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Cu Interconnects, Glass, and AI Assisted Simulation for Chiplets Heterogeneous Integration

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