Thermal Interface Task: This putty-form compound provides the physical interface for a heat-transfer task and a specific thermal putty application Jar-Packed Presentation: The putty comes in a jar as a single contained unit, combining its physical form with a defined container format Package Contents: Includes 1 jar of thermal putty as a single contained unit Putty-Like Form: The visible, putty-like presentation distinguishes the supplied compound and makes its physical format easy to recognize Physical Interface Compound: The thermal putty serves at the interface for the stated heat-transfer task
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