The dissipation design cools at speed and has a large number of dissipation holes to the machine stability during operation and the durability of the hardware. SECC material thickness 0.7 mm, materials, galvanized steel plate, high , toughness and deformation. Exquisite layout, more reasonable. Reasonable internal design, compatible with THN-TX motherboard. Suitable for motherboard: -ITX ultra-thin board (less than 17 x 17 cm), only supports self-powered DC IN motherboards.
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