THERMAL PUTTY FOR GPU AND PCB APPLICATIONS TG Putty Basic was developed as an alternative to conventional thermal pads for graphics cards and PCB components Very good heat conductivity and flexible use: as an easy to apply gap filler, the thermal clay compensates for height differences and is ideal for conversions and pad replacements IDEAL FOR GRAPHICS CARD REBUILDS AND COOLANT CHANGE Supports the replacement of multiple thermal pad thicknesses in VRAM, VRM and other PCB ranges Equalizes 0.2 to 3.0 mm. Designed for applications between PCB and cooler or backplate and for large-area application with the enclosed spatulas ELECTRICALLY NON-CONDUCTIVE FOR MORE APPLICATION SAFETY Suitable for sensitive components on graphics cards, but not for CPUs, Direct Die or directly on the graphics chip
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