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SUPERIOR HEAT CONDUCTIVITY Due to the special composition of aluminum oxide, aluminum hydroxide and aluminum powder, the pad provides peak heat transfer performance for absolute high-end systems Optimal surface adaptation: the soft consistency allows excellent compressibility - adapts perfectly to the structures of the heat source and cooler to consistently avoid air pockets Maximum safety: the pads are electrically non-conductive - this prevents short circuits and reliably protects your hardware while ensuring efficient heat transfer from the component to the cooler Easy installation: the pads are user-friendly and can be easily cut to the required size - ideal for quickly loading chipsets and other electronic components Versatile selection: available in the dimensions 120 x 20 mm and 100 x 100 mm as well as in thicknesses from 0.5 mm to 3 mm - the exact solution for every hardware component and every gap