Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness

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Amazon Pages: 373, Edition: Third Edition 2026, Hardcover, Springer
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Pages: 373, Edition: Third Edition 2026, Hardcover, Springer

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  • 9783032234889

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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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