Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness

Springer
Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness

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Amazon Pages: 373, Edition: Third Edition 2026, Hardcover, Springer

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Pages: 373, Edition: Third Edition 2026, Hardcover, Springer

Brand	Springer
EAN	9783032234889

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Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness

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