Lead-free electronic solder: EL Sn100Ni+; 70 g DIN EN ISO 9453:2006 Melting temperature : 227°C Flux content : 2 to 3.5% standard halogen content : halogen free Ø : 1.0mm Low-residue, halogen-free no-clean solder wire. Specially adapted to the requirements of electronics production. The flux is characterized by high temperature resistance and does not spatter during melting. The bright, solid flux residues are neither corrosive nor electrically conductive and can therefore remain on the solder joint The Sn100Ni+ alloy has outstanding soldering and physical properties. In addition to the extremely low copper alloying, the service life of the soldering iron tips is also noticeably extended. The soldered joints exhibit the shine familiar from leaded soldering technology
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