KAHDGSS Multiple Size Solder Stencils for Electronics Repair BGA78 to BGA152 Pattern

Multiple Size Option: This reballing stencil offering various specifications ( BGA78, BGA82, BGA96, BGA102, BGA132, BGA152) to accommodate different chip sizes and types, providing flexibility for repair and production needs Wide Application Ranges: Ideal for electronics repair, semiconductor packaging, and large scale soldering processes, this reballing stencil is a must have tool for professional in the field Easy Maintenance: For optimal and long use regularly clean the stencil with cleaning solution to residues buildup and ensuring consistent results Enhanced Soldering Efficiency: By minimizing solder ball waste and reducing soldering defects, this stencil helps boosting overall production efficiency while lowering operational costs Hole Design: The stainless steel stencil features holes that ensuring accurate alignment, significantly improving the success rate and consistency of solder ball placement