250g roll of lead-free tin solder with a diameter of 1.00 mm for creating permanent, firmly bonded soldered connections Due to the silver content of 0.3%, the lead-free tin solder achieves an increased electrical conductivity No-Clean Flux: Residue-free flux, which is increasingly used in electronics productionis used.No cleaning of the soldering points necessary after soldering Causes a small amount of smoke during the soldering process and is free from any halogens Composition: 0.3% silver, 0.7% copper, 96.5% tin Flux content: 2.5% Melting point 217 ° C
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