Gelid Solutions GN-Ultimate 6W Thermal Putty 30 g. Non-Electric - Density (g/cm): 3.3 Temperature C: -30 to 200C High Conductivity Compatible with Apple, Intel, AMD, Nvidia

EXCEPTIONAL DISSIPATION PERFORMANCE - Professional Thermal Putty - The GN-Ultimate Thermal Putty offers very high thermal conductivity for fast heat transfer from CPU, GPU, VRM, motherboards, power modules and high power LEDs. Its soft, low-pressure formula ensures superior cooling than traditional silicone thermal pads, ideal for gaming PCs, notebooks and advanced cooling systems. SAFE AND NON-ELECTRICAL CONDUCTIVE - Advanced Thermal Conductive Material - This thermal compound is 100% non-electrically conductive, preventing short circuits. Perfect as a thermal interface for heatsink, processor and graphics cards, evenly fills the gaps between multiple chips and shared heatsinks ensuring low thermal resistance and an ultra-thin layer under pressure. NON-HARDENING & OIL LEAK-FREE FORMULA - LONG LASTING - Maintains stable and reliable performance over time without drying out, cracking or releasing oil. GN-Ultimate stays soft and effective in a wide temperature range from -22°F to 392°F, ideal for gaming PCs, high-performance laptops, consoles, LEDs and industrial devices. Easy application and perfect fit – Thermal paste for CPU/GPU – easy to apply and naturally adhesive, this heat conductive paste adapts to uneven surfaces for maximum contact and minimum resistance. The high compressive capacity ensures a perfect seal without mess, remaining stable even in the presence of vibration or thermal expansion, ideal for modding and custom systems. RELIABLE AND ROHS Compliant - High Quality Thermal Interface - Designed to meet the most stringent environmental and safety standards, GN-Ultimate Thermal Putty is RoHS compliant and ensures consistent thermal management and professional cooling performance, perfect for hardware technicians, assemblers and PC enthusiasts.