€ 7.28
Gelid Solutions GC-4-1g Thermal Compound for Heatsinks Maximum Conductivity Easy to Use Non-Corrosive
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Description
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Ultimate Thermal Conductivity To provide the best thermal interface and achieve highly efficient heat transfer of CPU, GP and chipset in mission-critical applications. Ultra-durable and non-curing. Stable performance under a wide temperature range from -30 to 150 °C Ultimate Conductivity Ensure GC-4 comes with the upgraded synthetic micronparticle thermal filler and polymer matrix to survive the ultimate conductivity. Perfect gap filling and optimal viscosity.
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Ultimate Thermal Conductivity To provide the best thermal interface and achieve highly efficient heat transfer of CPU, GP and chipset in mission-critical applications. Ultra-durable and non-curing. Stable performance under a wide temperature range from -30 to 150 °C Ultimate Conductivity Ensure GC-4 comes with the upgraded synthetic micronparticle thermal filler and polymer matrix to survive the ultimate conductivity. Perfect gap filling and optimal viscosity.
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