ENERMAX MARBLEBRON II 750 Watt Modular 3.1 ATX Gaming Power Supply 80PLUS Bronze & ETS-TD60D-ARGB Dual Tower with Digital Status Display Bundle; EMB750-TD60D-ARGB
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€ 78.38 |
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€ 78.38 |
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Description
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MARBLEBRON II supports the requirements of current systems. Ideal for high-performance graphics cards and processors. Thanks to the DC design and Japan. Primary capacitors, it has an efficiency of up to 88% @ 50% load. ATX 3.1: MARBLEBRON II supports the requirements of current GPUs. This allows a high power reserve of up to 200% Power Excursion for maximum stability – even with sudden load peaks. 6-way protection circuit and Japan. Primary Capacitors Thanks to the flexible individual mesh sleeve cable, it is easier to install and allows for clean cable routing behind the enclosure wall and contributes to improved airflow within the case. Powerful cooling solution for demanding PC builds with up to 250W TDP, dual tower design with 2 optimized FDB PWM fans (1x ARGB), nickel-coated cooling plate with six Ø6 mm heat pipes. The real-time digital status indicator monitors a possible overheating risk of the CPU. Includes high-performance Dow Corning TC-8888C thermal compound. The nickel-plated copper base allows for a seamless contact surface with the CPU and completely covers all hotspots. It is especially ideal for use with liquid metal thermal compound to exert the last % of the CPU limit. Composite heat pipe design can dissipate heat particularly efficiently and can reduce the temperature by up to 1°C compared to conventional heat pipes
MARBLEBRON II supports the requirements of current systems. Ideal for high-performance graphics cards and processors. Thanks to the DC design and Japan. Primary capacitors, it has an efficiency of up to 88% @ 50% load. ATX 3.1: MARBLEBRON II supports the requirements of current GPUs. This allows a high power reserve of up to 200% Power Excursion for maximum stability – even with sudden load peaks. 6-way protection circuit and Japan. Primary Capacitors Thanks to the flexible individual mesh sleeve cable, it is easier to install and allows for clean cable routing behind the enclosure wall and contributes to improved airflow within the case. Powerful cooling solution for demanding PC builds with up to 250W TDP, dual tower design with 2 optimized FDB PWM fans (1x ARGB), nickel-coated cooling plate with six Ø6 mm heat pipes. The real-time digital status indicator monitors a possible overheating risk of the CPU. Includes high-performance Dow Corning TC-8888C thermal compound. The nickel-plated copper base allows for a seamless contact surface with the CPU and completely covers all hotspots. It is especially ideal for use with liquid metal thermal compound to exert the last % of the CPU limit. Composite heat pipe design can dissipate heat particularly efficiently and can reduce the temperature by up to 1°C compared to conventional heat pipes