Surface resistivity values in the recommended range for Dissipative ESD packaging materials as defined by ANSI/ESD S541-2008 Matte topcoat is designed to resist solder balls from sticking to the label after exposure to molten wave solder UL Approved;Meets requirements of MIL-STD-202G, Method 215K Service temperature of -94 to 212° F (-70 to 100° C) For use with BMP61 Labeling System, BMP71 Label Printer (with adapter), BradyPrinter M611, TLS 2200 Thermal Labeling System, TLS-PC LINK Thermal Labeling System
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