34×38×12 mm aluminum heat sink is used for heat dissipation of TO-220/TO-247 packaged power devices, which can effectively reduce junction temperature and improve overall circuit stability. Compatible with power transistor heat dissipation, MOSFET heat dissipation, voltage regulator heat dissipation, and high-power diode thermal management. The product is used to quickly dissipate device heat into the air, improve heat dissipation efficiency, and prevent thermal failure caused by prolonged operation. The heat sink is made of high thermal conductivity aluminum material, and the fin structure increases the surface area, making it suitable for excellent heat dissipation in natural convection environments. When installing, attach the heat sink to the back of the device and use thermal conductive silicone or thermal conductive paste to stabilize it on the PCB through fixing buckles or screws.
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